By Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Three-dimensional (3D) integration is pointed out as a potential road for non-stop functionality progress in built-in circuits (IC) because the traditional scaling strategy is confronted with exceptional demanding situations in basic and fiscal limits. Wafer point 3D IC can take numerous kinds, and so they frequently comprise a stack of numerous thinned IC layers which are vertically bonded and interconnected by means of via silicon through TSV.
There is a protracted string of advantages that you'll be able to derive from 3D IC implementation similar to shape issue, density multiplication, more advantageous hold up and gear, stronger bandwidth, and heterogeneous integration. This publication offers contributions by means of key researchers during this box, masking motivations, expertise systems, purposes, and different layout concerns.
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Extra resources for 3D Integration for VLSI Systems
3D Integration for VLSI Systems by Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester